Answer / rekha

BGA stands for ball grid array. this is a type of package
for IC which is being used in mobile phones to reduce the
size of mobile phones and for durability

Answer / mahim

BALL GROUP ARRAY.

Technology of mounting of components in PCB.
Very delicate, mostly used in mobile phones circuits.

for small size, high frequency, the most common core material is a)air b)ferrite c)powdered ion d)steel

2 Answers  

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whether two way communication is possible or not in parallel communication

2 Answers  

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please somebody who have asked questions related to electronic and communication eng siemens 2010-2012 post here

0 Answers   Siemens,

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What are the differences between voltage and current controlled devices?

0 Answers  

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Explain the different modes of buck boost converter

0 Answers  

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How to convert a jk flip flop into sr flip flop and vice versa, a sr flip flop into d or t flip flop and vice versa?

0 Answers  

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11. BCSU card in BSC can support how many TRXs? 12. What is the command to check list of sites that are down?

5 Answers   NSN,

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why we use -48V in nokia BTS

0 Answers   TNS,

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what is the rolls rolls of an Engineer?

1 Answers  

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What is ionospheric bending?

0 Answers  

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i am b.sec with PCM now what can i do for higher education

0 Answers  

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What is a bistable multivibrator?

0 Answers  

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