how do you round the addition or subtraction of two numbers in assembler? what does the following code do? change process tool(code changes from dev to prd) the changes made to your code should be effected in live. How the process takes place. That is how can you move the code changes from development to production?
681Post New IBM Assembler Interview Questions
Name some of the built-in methods and the values returned by them.
1.what is the effect of vapour presuure in orifice plate flow measurement 2.which is more effective 2 pressure sensors or one single differential pressure sensor in orifice plate measurement 3.how to design a v/i converter and i/v converter 4.how many type of thermocouple are there 5.how many leads are there in thermocouple measurement 6.how pressure sensors are connected in level measurement in differential pressure method 7.what is the output of capacitive pressure sensor (ac or dc),how its o/p is signal charactarized 8.what is the physical meaning of discharge coeeficient,why it is calculated,orifice plate what is its value,why it is less than 1,Q at upstream is equal to or not equal to Q at downstream of orifice plate why?what is vena contracta in orifice plate 9.why rotameter is called variable area flowmeter,it can measure flow even if area is not varying,why it is made tapered 10.design a 10 bit counter ,which counter you will prefer 11.how to remove self heating error in RTD 12.which is more sensitive pt100 or pt50 13.why thermocouple are connected in parallel 14.what is lead contact error in RTD,how to avoid 15.what is P,PI,PID,PD controller,why there is no ID controller 16.what is override,split range,sequential,ratio,feedforward,cascade controller 17.why we moved from SR to JK and then JK to master slave JK flipflop,give correct reason 18.how to measure level of a closed container which contains vapour and liquid,remember no vapour gas should be leaked,so ultrasonic and capacitive is not an option,design another method 19.how to design horse race counter including sensors and signal conditioning element 20.what is bevelling
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